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Application 170

Die-Attach Force Measurement

Application Summary
Fragile semiconductor chips require delicate handling prior to packaging. During Through-Silicon Via (TSV), eutectic, epoxy, or solder based die attach processes, consistent force must be applied to the chip. Incorrect force application causes broken chips and incomplete bonds. Load cells incorporated into the die attach tooling enable closed loop control during this delicate process.
Products in Use
One LCM100 Miniature In Line Load Cell paired with Instrumentation (IPM650, IDA100, IAA300 Differential Strain Gauge Amplifier) View Product Details
Load Cell - Die-Attach Force Measurement
How it Works
  1. A LCM100 Miniature In Line Load Cell is between the pick and place head and armature.
  2. As the armature presses the chip down onto the die during the attach process, the LCM100 measures the force applied.
  3. The force applied is then displayed by IHH500 Intelligent Digital Hand Held Display or IPM650 Panel Mount Display.
  4. Utilizing the IAA300 analog amplifier or the analog outputs from the IDA100 or IPM650, an amplified output can be sent to a PLC for automated die attach processes.
  5. The ultra-low noise output from the IAA300 makes it ideal for high precision motion control.
All FUTEK application illustrations are strictly conceptual. Please contact us with questions.
Load Cell - LCM100 - Miniature In Line Load Cell
Miniature In Line Load Cell
Load Cell - IPM650 - Panel Mount Display
Panel Mount Display
Load Cell - IDA100 - Digitally Configurable Amplifier
Digitally Configurable Amplifier
Load Cell - IAA300 - Differential Strain Gauge Amplifier
Differential Strain Gauge Amplifier
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