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Die Attach Force Measurement | FUTEK

Die Attach is also usually known in the semiconductor industry as Die Bonding or Die Mount. It is the process of bonding a silicon chip to the Die pad of the support structure. This is a key stage in the Semiconductor manufacturing process and the use of a specialized Die Attach/Die Bonding machine is essential to guarantee process productivity and quality.


Fragile semiconductor chips require delicate handling prior to packaging. During Through-Silicon Via (TSV), eutectic, epoxy, or solder-based die attach processes, consistent force must be applied to the
chip. 


Incorrect die attach force application causes broken chips and incomplete bonds. Load cells incorporated into the die attach tooling enables closed-loop control during this delicate process.

How it Works
  1. A LCM100 Miniature In Line Load Cell is between the pick and place head and armature.

  2. As the armature presses the chip down onto the die during the attach process, the LCM100 measures the force applied.

  3. The force applied is then displayed by IHH500 Intelligent Digital Hand Held Display or IPM650 Panel Mount Display.

  4. Utilizing the IAA300 analog amplifier or the analog outputs from the IDA100 or IPM650, an amplified output can be sent to a PLC for automated die attach processes.

  5. The ultra-low noise output from the IAA300 makes it ideal for high precision motion control.

Products in Use

One LCM100 Miniature In Line Load Cell paired with Instrumentation (IPM650, IDA100, IAA300 Differential Strain Gauge Amplifier)

Contact Us
All FUTEK application illustrations are strictly conceptual.
Please Contact Us with questions.

Die Attach is also usually known in the semiconductor industry as Die Bonding or Die Mount. It is the process of bonding a silicon chip to the Die pad of the support structure. This is a key stage in the Semiconductor manufacturing process and the use of a specialized Die Attach/Die Bonding machine is essential to guarantee process productivity and quality.


Fragile semiconductor chips require delicate handling prior to packaging. During Through-Silicon Via (TSV), eutectic, epoxy, or solder-based die attach processes, consistent force must be applied to the
chip. 


Incorrect die attach force application causes broken chips and incomplete bonds. Load cells incorporated into the die attach tooling enables closed-loop control during this delicate process.

die attach force measurement
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Multi Axis Sensor, Force, Torqueapplications Die-Attach-Force-Measurement
+
Z540-1 ANSI Certified17025 ISO Certified9001 ISO Certified13485 ISO CertifiedU.S. Manufacturer
+
Please follow us on linked inPlease follow us on twitterPlease follow us on youtubePlease Email us for additional info
+
10 Thomas, Irvine,
CA 92618 USA
All other trademarks, service marks and logos used in this website are the property of their respective owners.
© 1998–2022 FUTEK Advanced Sensor Technology, Inc. All rights reserved.