Ultra-Low-Power Miniaturized Integrable Sampling System
This strain gauge conditioning module enables OEMs and integrators to quickly move from concept to working hardware, by eliminating the need to design, tune, and validate a custom mV/V analog front‑end, while significantly simplifying PCB layout. By integrating an optimized, ultra‑compact signal‑conditioning stage, teams can focus on value‑add electronics, reduce board complexity, and accelerate design cycles compared to discrete solutions.
Wide Bridge Sensitivity
Wide Bridge Sensitivity ensures compatibility with load cells, force transducers, torque, pressure, and strain‑gauge sensors with millivolt‑level outputs.
Compact Form Factor
Ultra‑compact PCB footprint simplifies PCB layout for dense embedded designs, handheld instruments, and multi‑channel systems.
Dual digital outputs: UART and SPI
Flexible digital interfacing to most microcontrollers and embedded platforms supports simple serial links and high‑speed SPI.
Synchronized Data Acquisition
Dedicated data-ready output allows a host system to read a new ADC conversion upon completion, reducing latency and enabling synchronized data acquisition.
High resolution and Accuracy
Precision front‑end and high‑resolution ADC architecture support accurate measurement of low‑level signals with excellent stability.
Configurable Sampling rate and Filtering
On‑module digital filtering and adjustable sampling rates help balance noise performance and response time for a given application.
Low Power Consumption
Low power consumption and wide input voltage range ensure compatibility with battery‑powered robotics (including humanoids and exoskeletons), portable medical devices, and multi‑channel installations.
Calibration and scaling options
Zero, span, and scaling adjustments via digital interface, streamline sensor calibration in production.
This strain gauge conditioning module enables OEMs and integrators to quickly move from concept to working hardware, by eliminating the need to design, tune, and validate a custom mV/V analog front‑end, while significantly simplifying PCB layout. By integrating an optimized, ultra‑compact signal‑conditioning stage, teams can focus on value‑add electronics, reduce board complexity, and accelerate design cycles compared to discrete solutions.
Wide Bridge Sensitivity
Wide Bridge Sensitivity ensures compatibility with load cells, force transducers, torque, pressure, and strain‑gauge sensors with millivolt‑level outputs.
Compact Form Factor
Ultra‑compact PCB footprint simplifies PCB layout for dense embedded designs, handheld instruments, and multi‑channel systems.
Dual digital outputs: UART and SPI
Flexible digital interfacing to most microcontrollers and embedded platforms supports simple serial links and high‑speed SPI.
Synchronized Data Acquisition
Dedicated data-ready output allows a host system to read a new ADC conversion upon completion, reducing latency and enabling synchronized data acquisition.
High resolution and Accuracy
Precision front‑end and high‑resolution ADC architecture support accurate measurement of low‑level signals with excellent stability.
Configurable Sampling rate and Filtering
On‑module digital filtering and adjustable sampling rates help balance noise performance and response time for a given application.
Low Power Consumption
Low power consumption and wide input voltage range ensure compatibility with battery‑powered robotics (including humanoids and exoskeletons), portable medical devices, and multi‑channel installations.
Calibration and scaling options
Zero, span, and scaling adjustments via digital interface, streamline sensor calibration in production.